ABSTRACT
Chemical–mechanical planarization (CMP) chemically or mechanically polishes the semiconductor’s surface for planarization. The features of CMP polishing machines include automation, high precision, reproducibility, and control of process parameter. The core of CMP technology is slurry for CMP based on nanotechnology, even though the importance of CMP technology was highlighted before the introduction of a nano process for semiconductor processing. The CMP process has a higher possibility of defects than other processes because it uses abrasive in slurry. It especially causes scratches; therefore, controlling the defects is important. Manufacturing of smaller devices necessitates the introduction of new materials and processes. The role of CMP is expanding and its importance is also being augmented. The improvement of operation capacity and speed, thanks to the development of semiconductor technology, is playing a key role in the rapid progress of current scientific technologies.
