ABSTRACT
This conclusion presents some closing thoughts on the concepts covered in the preceding chapters of this book. The book provides a global design method for the conception of three dimensional (3D) integrated circuits in electrical, thermal, electrothermal, and noise field models. It includes simulation methods for single through-silicon via (TSV), TSV matrix, multilayers substrate, multiprocessors, and heat dissipation design. The book presents some thermal and electrothermal modeling methods. It proposes an analytical thermal solution for multilayers substrate nonstationary temperature distribution. The book also provides an extensive study of power and thermal dissipation issues in 3D integration. As a solution to the local heat dissipation, a passive heat dissipation component, a flat heat pipe, is proposed as a prospective device. The book also proposes noise analysis methods and investigate the keep-out-of-zone of TSV to transistor. The investigation methods of electrical noise impact and thermo-mechanical noise impact show large influence to nMOS like device.
