ABSTRACT
ABSTRACT: For improvement of quality of cathodic rainfall in electrochemistry of metals the additives of the Surfactants (S) promoting receiving plastic cathodic rainfall are widely applied. At electro refinement of copper as such additive use thiourea. Identification of dependence between concentration of thiourea in sulfuric acid sulphate copper electrolyte and the average size of a crystal of the cathodic deposit received in the course of copper electro refinement was the purpose of the real work. Confirmation is received that the method of raster electronic microscopy allows to determine the sizes of crystals of a copper cathodic deposit and can be recommended for a research of dependences of a crystal structure of cathodic rainfall on existence and concentration of surfactants in sulphatic copper electrolyte.
The development of the cathode surface determines the value of the exponent of the spiral SEN (Spiral Elongation Number). The method of testing cathode copper samples for spiral elongation is a means of measuring the quality of high-purity copper, which makes it possible to assess its recrystallization ability in accordance with the requirements of the European Standard EN 12893 [1].
