ABSTRACT

Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

part |4 pages

Part I: Introduction to Integrated Circuit Manufacturing Processes

chapter 2|72 pages

Front-End IC Fabrication Operations

chapter 3|78 pages

Back-End Fabrication Operations

part |2 pages

Part II: Impact of New Technologies

chapter 5|20 pages

Circuit Design Trends

chapter 6|66 pages

Changing Fabrication Techniques

chapter 7|16 pages

Packaging Technology Trends

chapter 8|42 pages

Electrical Testing of VLSICs and ASICs

part |8 pages

Part III: Contamination and Manufacturing Errors

chapter |2 pages

References

chapter 9|58 pages

Contamination

chapter 10|10 pages

Human-Derived Contamination

chapter 11|60 pages

IC Processing Contamination

chapter 12|4 pages

Contamination Control

chapter 14|40 pages

Materials Issues

part |22 pages

Part IV: Causes (Sources) of IC Failures

chapter 15|68 pages

Fabrication-Related Causes of IC Defects

chapter 17|30 pages

Reliability Improvement

part |2 pages

Part V: Introduction to Screening

chapter 18|36 pages

Screening