ABSTRACT
Various functional and environmental requirements will dictate the approach to designing a particular hybrid thick-film circuit. The transition from an electrical schematic to a thick-film circuit can be a complex process. Apart from the "black box" specifications of the circuit, the designer must keep in mind constraints such as size, weight, thermal requirements, cost, and reliability. Also, the design must be compatible with the design rules of available thick-film elements. There needs to be close proximity, coordination, and communication between the design engineer and the process and material engineers. The designer needs knowledge of both the thick-film material properties and limitations.
