ABSTRACT
This chapter takes a closer look at their design, construction, and use. The term multichip module implies that reference is being made to a module (subassembly) containing more than one chip. The Institute of Printed Circuits is actually involved in providing definitions and guidelines for Multichip modules (MCM) technology. Co-fired ceramic seems to be the most popular choice for the base material, but metals offer some advantages that are difficult to ignore. The higher packaging density commonly found in MCM packages often creates a heat transfer problem on a much higher scale than that found in the typical hybrid assembly. Some circuits will tolerate wide temperature swings without any harmful effect on their performance. Most component values change with changes in temperature.
