ABSTRACT
When comparing thick-film circuits to printed circuits, we have noted that one significant distinction is that thick film is an additive metallization process while printed circuits (as they are normally fabricated) use a subtractive metallization process. This distinction allows the deposition of components on thick-film circuits, a process not practical with printed circuits. Resistor networks are especially adaptable to thick-film technology because the conductors printed onto the ceramic substrate can be terminated in pads that form ready-made terminals for the resistors. Thick-film resistors are laid down by screening them onto the ceramic substrate and across the metal terminations of the conductor pattern. When resistors are screened and fired, it is reasonable to expect that they will be within 20% of their design value, provided their size and composition have been correctly selected.
