ABSTRACT
Soldering technology is one of the key issues of electronics assembly. Although other methods are sometimes used to connect components to circuit conductors, soldering is by far the most commonly used method. The basic concept of soldering is the use of intermetallic bonds, which are achieved when certain alloys are heated in the presence of the connecting surfaces to establish a conductive joint. The solder alloy necessary for solder paste metals is generated by mixing the metals in bulk form. Alloy compositions are not always tin/lead eutectic because it is sometimes necessary to change metals to provide higher soldering temperatures or to promote solder adhesion for special metallic surfaces used in hybrid assembly technology. Interconnection of hybrid assemblies with various other assemblies and electronic packaging designs is limited primarily by the physical properties of the alumina.
