ABSTRACT
Placement of discrete components on the thick-film ceramic substrate is a simple matter of making sure that the solder terminals are in contact with the solder paste and that the component is correctly aligned. Matching the component connections to the thick-film footprint is a matter of positioning them in the X, Y, and Z coordinates. “Positioning” means picking up the component from its stock location, moving it to the thick-film circuit, and positioning it on the screened solder paste. The wide variety of discrete components used in hybrid assembly operations makes a discussion of their placement on the substrate more than just describing a simple pick-and-place operation. The gull-wing lead is a shortened version of the planar or flat pack lead.
