ABSTRACT
The advancement of soldering technology has been remarkable in the last two decades. High-density packaging has been in the forefront of electronics packaging, especially for notebook-type personal computers and mobile phones. Lead-free soldering is now taking the position of the conventional leaded solders and much research effort has been exerted since around 1998 in commercial fields. In addition, in order to transform soldering processes to lead-free soldering, miniaturization of the soldering equipment and changes in the production infrastructures were started in 2001. New soldering technology has evolved in this way with surprising speed.
