ABSTRACT
In the previous chapters, we discussed the many aspects of this technology from the basic science to technology with legislative movements. The standard material as lead-free solder is, needless to say, Sn-Ag-Cu. Table 1.2 already showed the brief summary of composition, feature, some notes in application, etc., for lead-free solders in the market. For Sn-Ag-Cu alloy, there are slight differences in their compositions in Japan, the United States, and Europe. However, these compositions can be accepted and are available all over the world. These solders are most stable and possess good compatibility with the present technologies, e.g., components and their various platings, and high reliability. Especially, as their mechanical property is good, it is possible to extend the life of equipment by applying optimum mounting design and process control. As regards surface mounting, the property of lead-free pastes almost reaches the same level of the conventional Sn-Pb solder; in fact, there is no problem in productivity on many electronic products.
