ABSTRACT
As the development of compact, high-performance electronic devices progresses, there is an increasing demand for high-density mounting of electronic components. Consequently, insulation with excellent performance characteristics is needed to satisfy the following requirements. The distance between the conductors is shortened. Die bonding material to bond the encapsulation material is employed to protect the connection of semiconductor elements and the package. Support structures between a semiconductor element and the substrate are devised. Ball grid array (BGA) and chip-scale package (CSP) underfill material mounting is sometimes used to keep the interlayer material of the printed circuit board in sound conditions. Moreover, high heat radiation (high thermal conductivity), heat resistance, and electrochemical migration resistance are also target for intensive research. Polymer nanocomposites are now recognized
Mounting of Electronic Equipment PartsIn high-performance electronic devices, high-density mounting of components is adopted. In order to cope with the ultra-high frequency band above 10 GHz, three-dimensional mounting technologies are progressing, to avoid the signal delay caused by adding extra wiring routes. In order to meet the need to shorten the distance between conductors and between conductors and the build-up substrate, substrates composed of ceramic and resin have been utilized. Also, the environments around electronic devices are becoming increasingly severe and to address such changes in requirements, the following measures have been taken. First of all, high-quality insulation is now under development, since the insulation of multi-layered structure is subjected to high electric stress. Interlayer interfaces are a particular focal point for research. Second, compact design creates severe thermal conditions; high heat dissipation necessitates the use of materials that are characterized by high thermal conductivity. As shown in Fig. 14.1, to take advantage of the feature that the size of the chip component is small, design considering the footprint of the gap (interval) and the printed circuit board between the components, requires only manufacturing techniques can respond to it.
