ABSTRACT
The digital information age requires the use of different types of semiconductor materials. The electrical properties of semiconductor materials center around resistivity and dielectric constant. The material properties involved in the determination of the stresses in the die attach assembly include the modulus of elasticity, Poisson's ratio, and the coefficient of thermal expansion. The key material property involved in the thermal performance of the package is thermal conductivity. The bond strength of the attachment material is an essential property to ensure that the die and the substrate stay in place despite the stresses imposed during manufacture, storage, and operation. Substrate materials can be broadly classified into single-layer and multi-layer materials depending on their material compositions. In hybrid packages, the substrate materials are classified into two categories, depending on the technology used for conductor metallization; the thick-film technology substrate materials and the thin-film technology substrate materials.
