ABSTRACT
The development of substrate integration antenna technology is based on the concept of substrate integrated circuits (SICs). The principle of SICs is to convert non planar structures into their corresponding planar form, enabling the planar fabrication processing of those nonplanar and three-dimensional structures. In this case, conventional planar transmission lines, such as microstrip line and coplanar waveguide (CPW), can be integrated with these SIC structures on the same substrate with the same processing technology. In fact, any nonplanar guided-wave structure can be converted into its planar counterpart. SICs inherit the merits of nonplanar guidedwave structures and is very attractive for high-frequency applications.
