ABSTRACT
The hybrid shown in Figure 4-7 and Figure 4-9 is used as a basis for the manufacturing flow definition. To assist in the understanding of hybrid construction, the essential information about the circuit and processes used in component assembly are summarized in Table 6-1. The hybrid includes three separate ceramic substrates mounted in a flatpack case with molybdenum bottom. It has 32 I/O pins sealed in the alloy #52 sidewall with matched glass. The sidewall is brazed to the bottom and then plated with gold. In the final hybrid configuration the leads must be formed upwards extending by 0.5 inches above the cover.
