ABSTRACT

Embodied in the static-shielding bag, it is a conductive semitransparent, flexible, high strength, heat sealable container which, being an equipotential surface, prevents external electrical fields (created by any charged object or person) from causing induced charge potential differences inside. (The bag is to limit capacitive coupling of the external charge through its contents. Another form of construction for such a bag is the conductive grid bag.) Constructed, is one realization, as an outer polyester material bearing a thin metallic film with a transparent, abrasion-resistant overcoating, laminated to an inner layer of anti-static polyethylene film. The latter's function is to prevent triboelectric static charge generation by items inside the bag. FATIGUE: Used to describe a failure of any structure caused by repeated application of stress over a period of time. FATIGUE FACTOR: The factor causing the failure of a device under repeated stress. FEATHERS: See curies. FEEDTHROUGH: A conductor through the thickness of a substrate,

thereby electrically connecting both surfaces. FERRITE: A powdered, compressed, and sintered magnetic material having high resistivity; cores made of sintered powers are used for ferromagnetic applications. FERROELECTRIC: A crystalline dielectric that exhibits dielectric hysteresisan electrostatic analogy to ferromagnetic material. FERROMAGNETIC: A material that has a relative permeability noticeably exceeding unity and generally exhibits hysteresis. FIELD TRIMMING: Trimming of a resistor to set an output voltage, current, etc. FILLER: A substance, usually dry and powdery or granular, used to thicken fluids or polymers. FILLET: A concave junction formed where two surfaces meet. FILM: Single or multiple layers or coating of thin-film or thick material used to form various elements (resistors, capacitors, inductors) or interconnections and crossovers (conductors, insulators). Thin-films are deposited by vacuum evaporation or sputtering and/or plating. Thick-films are deposited by screen printing. FILM CONDUCTOR: A conductor formed in situ on a substrate by depositing a conductive material by screening, plating, or evaporation techniques. FILM NETWORK: An electrical network composed of thin-film and/or thick-film components and interconnections deposited on a substrate. FINAL SEAL: The manufacturing operation that completes the enclosure of

ert gas, nitrogen, or forming gas flowing over a heated integrated circuit chip or a substrate that keeps the metallization from oxiding during bonding. GATE CHAIN: Large numbers of FETs connected in parallel, with common source, common drain, common gate and substrate. Gate chain is used in VSLI technology as a test structure, placed in the "street" (kerf) areas separating dice on a wafer, for probing; mostly for determining the levels of defects as a way of process monitoring and characterization. Benefits hybrids, using VLSI devices. G E L TIME: The time (in seconds) required for prepreg resin to melt and solidify when heated. GLASS BINDER: The glass powder added to a resistor or conductor ink to bind the metallic particles together after firing. GLASSIVATION: An inert, transparent, glass-like thin layer of pyrolytic insulation material that covers (pasivates) the active device areas, including operating metallization on the wafer, but excluding bonding pads, bumps, and beam leads. GLASS PHASE: The part of the firing cycle wherein the glass binder is in a molten phase. GLASS TRANSITION TEMPERATURE

(Tg): In polymer chemistry, the temperature below which the thermal expansion coefficient becomes nearly constant or a simple function of temperature. The temperature at which amorphous polymers change from a hard and brittle state to a soft rubbery state. Most of the material properties

change rapidly and significantly at this temperature. GLAZE: See overglaze. GLAZED SUBSTRATE: A glass coating on a ceramic substrate to effect a smooth and nonporous surface. GLOB-TOP: A glob of encapsulant material surrounding a die in the COB (chip-on-board) assembly process. Note: the attached dice must have been pretested/inspected/passed, as rework after final curing of the epoxy or silicone globs is virtually impossible. GLOSSY: A shiny surface usually formed by the glass matrix in a conductor or resistor ink.