ABSTRACT
LIFT-OFF MARK: Impression in bond areas left after lift-off removal of a bond. LINE CERTIFICATION: Certification that a production line process sequence is under control and will produce reliable circuits in compliance with requirements of applicable mandatory documents. LINE DEFINITION: A descriptive term indicating a capability of producing sharp, clean screen printed lines. The precision of line width is determined by twice the line edge definition/line width. A typical precision of 4% exists when the line edge definition/line width is 2%. LINEAR CIRCUIT: A circuit with an output that changes in magnitude with relation to the input as defined by a constant factor (See analog circuits). LINES: Conductor runs of a film network. LlQUlDUS: The line on a phase diagram above which the system has molten components. The temperature at which melting starts. LOAD LIFE: The extended period of time over which a device can withstand its full power rating. LOOP: The curve or arc by the wire between the attachment points at each end of a wire bond. LOOP HEIGHT: A measure of the deviation of the wire loop from the straight line between the attachment points of a wire bond. Usually, it is the maximum perpendicular distance from this line to the wire loop. LOOSE FLLL (ANTI-STATIC): A type of packaging material, such as shred-
dings, flakes, and "peanuts" of plastic, properly treated during fabrication. The "peanuts" are electronic-grade, lightweight cushioning products usually made of expanded polystyrene and often provided with an anti-static coating. LOSS TANGENTS: The decimal ratio of the irrecoverable to the recoverable part of the electrical energy introduced into an insulating material by the establishment of an electric field in the material. LOW-LOSS SUBSTRATE: A substrate
with high radio-frequency resistance and hence slight absorption of energy when used in a microwave integrated circuit.
