ABSTRACT
TO-METAL SEAL): An insulating seal made between a package lead and the metal package by forming a glass bond to oxide layers on both metal parts. In this seal, the glass has a thermal coefficient of expansion that closely matches the metal parts. METAL THERMAL VIAS: Internal risers in multilayer substrates to spread and dissipate heat by providing paths to a thermally-conducting plane which acts as a heat sink. MICROBOND: A bond of a small wire such as 0.001-inch diameter gold to a conductor or to a chip device. MICROCIRCUIT: A small circuit (hybrid or monolithic) having a relatively high equivalent circuit element density, which is considered as a single part on (hybrid) or with (monolithic) a single substrate to perform an electronic circuit function. (This excludes printed wiring boards, circuit card assemblies, and modules composed exclusively of discrete electronic parts).
