ABSTRACT
This chapter describes a novel noninvasive test and characterization strategies suitable for radio frequency (RF) systems-on-chip (SoCs) employing Direct Current (DC) and low-frequency noninvasive temperature measurements. It presents the physical principles of the thermal monitoring to test/characterize analog/RF circuits. It details the aspects of the thermal coupling mechanism affecting the temperature test and discusses how the Joule effect behaves as a frequency down-conversion mixer that allows DC and low-frequency measurements to characterize the electrical high-frequency performances of the circuit under test (CUT). It elucidates the relationship between electrical high-frequency performances and DC and low-frequency temperature variations. It derives the relations between electrical performances and temperature variations analytically by using a common-source tuned-load amplifier. It also presents different methods to measure temperature, which focus on the use of built-in differential temperature sensors to measure electrical performances at low cost. The chapter further shows experimental results of the electrical performances obtained through thermal measurements by means of built-in thermal sensors.
