ABSTRACT
This chapter presents wafer-level three-dimensional technology platforms, with emphasis on dielectric adhesive bonding using benzocyclobute. It provides digital applications such as microprocessors and ASICs, with emphasis on performance prediction of static random access memory stacks for high-density memory. The chapter explains analog/mixed-signal applications, with emphasis on wireless transceivers for software radios. It also provides unique system architectures enabled by wafer-level 3D integration, with emphasis on both first point-of-load (PoL) DC/DC converters for power delivery with wide control bandwidth and then a novel system architecture using optical clocking for synchronous logic without latency. The chapter also presents technology and system drivers that need to be addressed before wafer-level 3D technology platforms are implemented for high-volume manufacturing. Wafer-level 3D provides an opportunity to partition analog and digital functions into different strata, with process flows and parameters selected to optimize each functional requirement.
