ABSTRACT
This chapter focuses on thermal challenges of Three-dimensional integrated circuit (3D ICs). It describes an approach for system-level electrothermal simulation of 3D ICs. The chapter presents a system-level electrothermal flow. It organized as follows: presents major approaches to electrothermal simulation, an approach to system-level electrothermal simulation, a case study comparing a 2D and three 3D implementations of a quad-core chip multiprocessor (CMP).3D IC is a promising technology that has potential to achieve higher device densities than technology scaling alone while improving energy efficiency. To illustrate the 3D IC specific features, the first three tiers of a five-tier 3D technology, called FreePDK3D45.3D integration provides a rich variety of choices to system designers such as homogenous vs. heterogeneous partitioning of a design, number of stacking layers in 3D design, integration of heterogeneous technologies, and different types of 3D bonding methods, resulting in vast 3D design space.
