ABSTRACT
Technology computer-aided design (TCAD) refers to the use of computer simulation to model semiconductor processing and device operation. TCAD provides insight into the fundamental physical phenomena that ultimately impact performance and yield. Process variability is becoming more and more design for manufacturing challenges for designers as new process steps are added for advanced technology nodes. By integrating TCADderived models with physical design tools, the designer can focus on optimising variation awareness for increased performance, productivity, and predictability. From the 90 nm node onward, issues with manufacturability and yield have forced the electronic design automation (EDA) industry and manufacturing to move closer together. In particular, process and device information that affect functionality and yield need to be incorporated into the design flow, addressing more comprehensively issues of design for manufacturing (DFM) and yield (DFY). For true DFM and DFY, it is necessary to include process variability in the design process. From the 65 nm node, the variability has increased significantly further as a result of feature scaling and the introduction of new materials and innovative techniques such as strain engineering. The information needed by designers includes layout sensitivity as well as the effect of process variability on the electrical characteristics of devices and interconnects.
