ABSTRACT
This chapter focuses on integrated circuit (IC) technology. It explains solid-state power devices. The chapter presents a short summary to three semiconductor technologies typically used in high-temperature environment. The first semiconductor technology typically used is standard silicon ICs that have been carefully designed and screened, so they can operate under the targeted extreme environment. The second IC technology is high-temperature silicon on insulator (HTSOI). HTSOI has been specifically separated from SOI because of its higher temperature capability. Last, wide bandgap electronics have the ability of operating at temperature beyond 200°C. For purposes of this discussion, wide bandgap will refer to both silicon carbide and gallium nitride devices. New components are continuously being developed and commercialized allowing for greater and increased performance of extreme environment power electronics systems.
