ABSTRACT
Interconnection of electronic signals is the most fundamental technology for microsystems packaging technology. Interconnection technology can be used to transfer various physical signals between chips and chips, chips and package, and devices and substrates. Braze-welding was the earliest interconnection technique used in electronic engineering. Chip-level interconnection is also the core technology used to realize high-performance System in package (SIP). Wire bonding, tape automated bonding, flip-chip bonding, and any other interconnection technology that can directly connect integrated Circuit chips can be used to achieve the high performance of SIP. Wire-bonding plays a very important role in interconnection technology in electronic engineering for its maturity, simple technique, low cost, and strong applicability, and it is widely used in microsystems packaging. Depending on the degree of bonding automation, wire bonding can be divided into manual bonding, semi/automatic bonding, and auto bonding. For copper wire bonding, protective gas should be used in electronic ignition to prevent copper ball oxidation.
