ABSTRACT
Device-level package (DLP), also called single chip package, encapsulates a single circuit or chip to provide it with the necessary electronic connections, mechanical support, thermal management, protection from harmful elements, and an interface for future applications. As a very important part of microsystem package technology, DLP guarantees a normal chip proper operation and communication between the chip and the environment. In the 1960s, the double in-line package with a ceramic shell was born, that is, ceramic double in-line packaging. Metal packaging uses metal as a shell or base to seal and protect a chip or chips. A plastic package uses resin material to encapsulate a semiconductor device or circuit chip and is usually considered nonhermetic package. With the development of ceramic tape-casting, the ceramic package becomes more flexible in shape and function. Ceramic packages mainly include metal ceramic packages and common ceramic packages with great varieties.
