ABSTRACT
This chapter deals with the common laser diode and light emitting diode packaging and discusses some special optoelectronic packaging processes. The module assembly is a package of one or several components on one substrate to form a functional block. The module assembly technology advances with component fabrication technologies, while it also influences the component packaging trend. Optoelectronic packaging covers many areas, such as optoelectronic module and component packaging, where optoelectronic component packaging is the basic model. Optical electronic integrated circuit and photonic integrated circuit are involved in optoelectronic packaging. Anisotropic conductive film (ACF) is an anisotropic conductive thin adhesive film, which completes interconnection and adhesive curing at the same time in the packaging process. Compared to ACF packaging, the isotropic conductive adhesive bonding process is relatively more complicated with lower bonding strength. Optoelectronic packaging design consists of optical, electrical, thermal, and mechanical aspects of the system level.
