ABSTRACT
This chapter discusses the key issues of microsystem reliability and describes wafer- and packaging-related failures and mechanisms separately. Many critical areas, such as medical, aerospace, and military applications, have extremely high requirements for product reliability, where failure can have life-threatening consequences. The chapter explores the techniques for micro electromechanical system failure analysis: failure localization techniques, characterization techniques and subsidiary techniques. The high cost of unreliability motivates an engineering study on microelectronics reliability. Ideally, reliability testing should be conducted in the same environment as the product specified. The normal distribution is commonly used for general reliability analysis and times-to-failure of simple electronic and mechanical components, equipment, or systems. Reliability design based on and thoroughly implemented accelerated tests are a critical part of microsystems packaging. With the development of package technology, the various package types are emerging rapidly. Each technique has its own reliability issues.
