ABSTRACT
Historically, bulk acoustic wave techniques form the basis of ultrasonic waves in condensed media, and they have a long history dating from the very beginning of the subject with the discovery of piezoelectricity. This chapter provides an overview of IC technology, which should allow the uninitiated to follow the subsequent development of the text. The silicon wafer is the basic building block for all main line microelectronic devices. To make a microelectronic circuit or circuit element, it is necessary to draw an accurate large-scale pattern of the structure. This is optically reduced in size and the pattern is photographically printed on a mask. This pattern is then transferred by printing onto a thin layer of photoresist material deposited on the wafer. Lithography techniques have been used from the beginning in the fabrication of Surface acoustic wave devices.
