ABSTRACT
In the thermal control of radio frequency (RF) devices, it is necessary to provide an acceptable microclimate for a diversity of devices and packages that vary widely in size, power dissipation, and sensitivity to temperature. Although the thermal management of all electronic components is motivated by a common set of concerns, this diversity often leads to the design and development of distinct thermal control systems for different types of electronic equipment. Moreover, owing to substantial variations in the performance, cost, and environmental specifications across product categories, the thermal control of similar components may require widely differing thermal management strategies.
