ABSTRACT

The microelectro-mechanical systems (MEMS) are usually built using a top-down approach, while nanotechnology-based components are usually built bottom-up. This chapter presents an introduction to the physical laws governing MEMS behavior, and the description of the fabrication techniques most commonly used in the development of these devices. MEMS devices are considered to have characteristic dimensions in the range of 0.1–100 µm. This is a very important miniaturization, relative to the traditional, macroscopic world, that will affect the relative importance of physical phenomena. Silicon is the most important bulk material and the elemental semiconductor for MEMS fabrication because it combines multiple convenient properties: electrical and optical quality; good mechanical properties based on its robustness and elasticity and high stiffness; and easy growth of a silicon oxide layer as a good dielectric material. Because of these characteristics, many MEMS structures and devices can be integrated on silicon alone or combined with other materials.