ABSTRACT
This chapter aims to satisfy the existing growing demands by covering the fabrication processes starting from the basics and coherently progressing to sophisticated microelectromechanical systems (MEMS) fabrication technologies, processes, and materials. It has been emphasized that the photolithography processes are embedded in IC and MEMS fabrication. The major steps for IC fabrication are diffusion, oxidation, polysilicon gate formations, photolithography, masking, etching, metallization, wire bonding, etc. Micromachined silicon wafers must be bonded together. Complementary metal oxide semiconductor (CMOS), high-aspect-ratio, and surface micromachining technologies are key factors for development, implementation, and commercialization of ICs and MEMS. Assembling and packaging of MEMS includes microstructure and die inspection, separation, attachment, wire bonding, and packaging or encapsulation. Bulk and surface micromachining are based on the modified CMOS technology with specifically designed micromachining processes. Surface micromachining has been widely used in the commercial fabrication of MEMS and microdevices and microstructures.
