ABSTRACT
This chapter provides a basic description of the Level 0, Level 1 and Level 2 packaging of electronics devices. Micromechanical sensors for pressure and acceleration have used semiconductor manufacturing technology for several decades, but innovations allow further miniaturization, greater flexibility, and compatibility with microelectronics. Microelectronic devices are silicon-based digital logic elements that have several millions of transistors integrated to form logic circuit elements on a micron scale. Many of the features on the microelectronic devices are moving into the nanometer scale. Device packaging or Level 1 packaging involves the assembly and interconnection of the microelectronic, optoelectronic, or Microsystems device onto a lead frame arrangement or substrate. Packaging is a multifaceted, highly interdisciplinary technological field facing significant challenges due to miniaturization and multifunctional integration. The proliferation of electronics into portable devices, consumer products, and automotive, military, aerospace, medical, and industrial applications is forcing more compact and ruggedized packaging.
