ABSTRACT
Appendix ....................................................................................................................................324
References ....................................................................................................................................327
This chapter discusses the problem of alignment in an exposure tool and its net result:
overlay. Relevant concepts are described and standard industry terminology is defined.
The discussion has purposely been kept broad and tool-nonspecific. The content should be
sufficient to make understanding the details and issues of alignment and overlay in
particular tools relatively straightforward. The following conventions will be used:
orthogonal Cartesian in-plane wafer coordinates are (x,y) and the normal to the wafer
or out-of-plane direction will be the z axis.