ABSTRACT
Successful radio frequency (RF) and microwave package design involves adherence to a rigorous and systematic methodology in package development together with a multi-disciplined and comprehensive approach. New developments in package design systems have paved the way for rapid package prototyping through computer integrated manufacturing systems by tieing the design itself to the machining equipment that will form the package. The mechanical package designer may develop several simulations with various materials to input into the cost-reliability matrix. The mechanical analysis must encompass attachment of the RF or microwave component or module to the customer system. The Monte Carlo analysis then can develop expected RF performance parameters for the characterized process within the defined process windows. From mean time before failure point of view, the thermal aspects of the circuit/package interaction are one of the most important aspects of the package design itself.
