ABSTRACT
Recent upsurge of interest in thermal transport behavior of low-dimensional structures has been
motivated by two main factors. The second half of the twentieth century witnessed an emphasis on the
process of miniaturization in microelectronic devices and circuits. The use of thin semiconductor
chips with ever-increasing chip density has led to an increase in power dissipation per unit area.
Obviously the heat thus generated has to be carried away by efficient thermal management. Materials that
can do this job well will be of considerable interest in device design. On the other hand, semiconducting
materials with low thermal conductivity are of special interest in thermoelectric devices (generators and
refrigerators).
