ABSTRACT
Multichip module (MCM) technology allows bare integrated circuits and passive devices to be mounted together on a common interconnecting substrate. In its broadest sense, a multichip module is an assembly in which more than one integrated circuit are bare mounted on a common substrate. With flip-chip solder-bump attachment, solder bumps are deposited over the area of the silicon wafer. The wafer is then diced into individual die and flipped over the MCM substrate. An important adjunct to the physical technology is the technology required to test and repair the die and modules. An important question that has to be answered for every MCM is how much to test the die before assembly versus how much to rely on post-assembly test to locate failed die. Design technology is also an important component to the MCM equation. The most important issue in the design of multichip modules is obtaining bare die.
