ABSTRACT
Failures of semiconductor devices in storage, or dormant applications, are the result of latent manufacturing defects that were not detected during device screening tests. For discrete semiconductors, such as transistors, a large percentage of failures are the result of die and wire bonding defects and contamination. Hybrid devices are a combination of active components and various passive discrete parts mounted on a substrate and interconnected by conductive film traces. Hybrid failure mechanisms, like those of discrete and integrated circuits, are primarily due to manufacturing defects. Devices can be classified by package style, which can either be hermetically sealed or non-hermetic. Materials employed in most microcircuits will change very slowly if stored in a dry environment at a constant low temperature. Reducing lead in the environment is an environmental health and safety issue that is of prime importance today. Pink poly bags are also used to contain components or assemblies.
