ABSTRACT
This chapter describes heat management of electronic packaging. Thermalcooling/heatmanagement is one of several major functions provided and maintained by a packaging structure or system. The evolution of chip technology and of packaging technology is strongly interdependent. Very large-scale integrated (VLSI) packaging and interconnect technology are driven primarily by improvements in chip and module technologies, yield, and reliability. Finite element models (FEM) have been gaining recognition as tools to carry out analyses of VLSI packages due to the versatility of FEM procedures for the study of a variety of electronic packaging problems, including wafer manufacturing, chip packaging, connectors, board-level simulation, and system-level simulation. The data is presented in terms of heat transfer coefficients that correlate dissipated power or heat flux with increase in temperature. In the analysis of construction of VLSI-based chips and packaging structures, all modes of heat transfer must be taken into consideration, with natural and forced air/liquid convection playing the main role in the cooling process of systems.
