ABSTRACT
This chapter describes shielding and electromagnetic interference (EMI) Considerations of electronic-system packaging. One principal method of dealing with EMI is to shield the source, the victim, or both, so that only intentional radiation will couple between them. The problem, then, is to control unintentional radiation coupling into or out of victim circuits, their printed circuit boards (PCB), their housings, and equipment interconnecting cables. Shielding may be performed at the component level, PCB or backplane level, card-cage level, box level or entire system level. Card-cage shielding can add additional shielding effectiveness if the cards are single-layer boards. Most aperture leakage control is divided into four sections: printed circuit boards (PCB). The first of the four aperture-leakage categories is viewing aperture windows. The chapter explains the method of mounting wire screen over an aperture and effectiveness of thin-films shields.
