ABSTRACT
The role of the SiGe package is more important than other IC packages, since the SiGe devices make it
possible to integrate digital, analog, and radio frequency (RF) functions on the same die and process.
More care should be taken to minimize the noise and parasitic in the package of the SiGe die than the
usual integrated circuit (IC) package. Packaging is a method for allowing electrical connection to an
integrated circuit while maintaining and regulating its operating environment, and achieving perform-
ance, reliability, and cost requirements. The primary function of a package is to provide a means for
electrical connectivity from the semiconductor device to a printed wiring board (PWB), also known as a
printed circuit board (PCB). It provides a path for power to be applied to the chip as well as a way for
the data signals to be transmitted into and out of the chip. Its secondary function is to house and protect
the fragile chip from harsh environmental conditions, like moisture, light, and dust, that might hinder
its performance. Finally, the package provides a pathway for dissipating the heat generated by the
semiconductor device [1].
