ABSTRACT
The main technology drivers for space systems are size, weight, and reliability. The costs of space systems are proportional to their size and mass.
As mentioned in the previous chapters, a new approach to microphotonics is based on a silicon-on-insulator (SOI) platform that utilizes novel concepts such as photonic-band-gap structures, thin-film smart materials, and microoptoelectromechanical systems (MOEMS). These technologies provide active and passive components that can form the basis of sophisticated microphotonic integrated circuits (micro-PICs) with higher functional densities than traditional integrated optics. Integration of a photonic system substantially minimizes the system mass and volume, reduces the number of external interconnects, and facilitates greater redundancy for higher system reliability, as well as providing robust optical alignment.
