ABSTRACT
The advent of semiconductor and integrated circuits in the mid-twentieth century signaled a revolution in the electronic industry. As this industry began to explode, the need for miniaturization and interconnection reliability, increased device functionality, and higher-speed circuits resulted in the development of different manufacturing technologies aimed at packing more functionality into smaller spaces. Electronic connections are one of the most critical links of the interconnection system and essential elements in providing the electronic signal path. Evolution of modern electronic equipment towards small-scaled and high-density components prompted development of various connecting methods. Owing to its ability to wet and spread on a wide range of substrates using mild fluxes, tin has become the principal component of most solder alloys used for electronic applications. Indium-based alloys are more compatible with gold than tin, and the dissolution therein of gold is considerably slower.
