ABSTRACT
This chapter explains the design, modeling, technological processes, and characterization techniques developed to manufacture and characterize high-performance millimeter-wave elements and circuits such as membrane-supported low-loss band-pass filters, double-folded slot antennae, and Yagi–Uda end-fire antennae, based on silicon and gallium–arsenide micromachining. Because of the advantages of the membrane-supported components, all the critical millimeter-wave circuitry must be placed on the micro-machined dielectric membrane. The membrane-supported components can be modeled and optimized using IE3D simulation software. Although IE3D package includes an optimization engine, it is mandatory in the design to start from an initial solution for layout dimensions obtained by means of an analytical design approach. Membrane-supported antennae can be readily used for the manufacturing of hybrid integrated direct (video-type) receiving modules. The receiver consists of a membrane-supported antenna, a matching network, a flip chip Schottky detector diode bonded on bulk material, and a low-pass filter.
