ABSTRACT
Vias are widely used in multilayered printed circuit boards (PCBs) and three-dimensional (3D)/two-and-a-half-dimensional (2.5D) packages to connect horizontal traces on different layers. As a kind of vertical interconnector, via is an essential structure for the circuit integration. This chapter proposes de-embedded and semianalytical methods to model the vias used in PCBs and 3D/2.5D packages, respectively. For the through interposer vias, a semianalytical wideband modeling approach based on cylindrical mode expansion of electromagnetic fields is proposed to analyze the electrical properties of high-density through glass via (TGV) arrays. The power distribution network (PDN) inside an electronic package or PCB includes the power–ground planes and the signal traces. The through-hole via is an important discontinuous structure in a PDN. Usually, quasistatic methods are employed to extract its parasitic circuit. Through-hole vias connect the parallel-plate mode and the transmission mode. The vias are much smaller than the working wavelength.
