ABSTRACT
The thermal transfer adhesive approach in 1990 consisted of two different adhesives: Uralane 7760 paste adhesive or its equivalent, Hacthane 100, for fillet bonding of discrete components and Flexipoxy 100 film adhesive for bonding of flat-bodied components. This approach was a vast improvement over the previously used polysulfide adhesives, which had unacceptably bad outgassing performance. Flexipoxy 175F is far superior to Flexipoxy 100 in volume resistivity, thermal conductivity, and glass transition temperature. Flexipoxy 175F was also used to make a thermal transfer film adhesive. Flexipoxy 171 was the most promising candidate as of October 1990. It was made into a thermal transfer adhesive by adding alumina powder using the Ross dual planetary mixer, and then evaluated along with the unfilled version. The end goal is to develop a thermal transfer adhesive, it was possible to get more experimental data quicker by only examining the polymeric part of the thermal transfer adhesive and ignore the filler portion.
