ABSTRACT
Polyimides (PIs) have attracted much attention due to their good thermal stability, chemical resistivity, and excellent mechanical and dielectric properties in fabricating multichip module packaging, ultra-large scale integrated circuit technology, and printed circuit board fabrication (Gosh and Mittal 1996; Weiser et al. 2000; Ghosh et al. 2015). However, aromatic polyimides in their imidized form present low solubility in common organic solvents and infusibility, which make them difcult to process. Different approaches are used to improve the solubility and processability of aromatic polyimides without sacricing the chemical, physical, and mechanical properties. These methods include the incorporation of exible linkages, alicyclic or nonlinear moieties into the main chain, or bulky lateral substituents along the polymer backbone (Shang et al. 2006; Wang et al. 2006; Hamciuc et al. 2011, 2013; Carja et al. 2012; Sava et al. 2015).
