ABSTRACT
This chapter explains the need for low-dielectric constant materials in advanced integrated circuit (IC) interconnects followed by the basic theoretical background of dielectric materials and the general methods of reducing the dielectric constant k. Various low-k materials are discussed with a focus on state-of-the-art organic low-k polymers, including their structures, syntheses, properties, and characterization. Basic back-end-of-the-line (BEOL) device fabrication processes are introduced so that the reader will better understand the requirements of low-k dielectric materials and the device integration challenges.
