ABSTRACT
Sputtering is a low pressure physical vapor deposition process where ions are accelerated from a plasma across a potential drop to bombard the sputtering target. Alternating Current (AC) sputtering is a technique where an alternating current is applied between two sputtering targets independently from ground. AC sputtering is characterized by the complete absence of a net DC current flow through the targets or any current flow through the chamber walls to ground. Radio Frequency (RF) diode sputtering has been a standard method for sputtering dielectrics since the 1960s. In RF sputtering, the frequencies are normally greater than 1 MHz. The sputtering rates depend on the power coupled to the magnetrons and the state of the target. To obtain maximum deposition rate, the target should be sputtered fast enough to prevent compound formation on the target. New AC power supplies are becoming available which are intended to allow two targets of different materials to be sputtered.
