ABSTRACT
In the quest to develop faster computers with smaller and denser populated microelectronic packages, cooling becomes one of the toughest engineering challenges.
The development of ECL (emitter coupled logic), as used in the CRAY-2 supercomputer and the more recent GaAs based semiconductor technology as used in the CRAY-3, add to this thermal management challenge. This new technology increases switching speeds and, hence, dramatically increases the need for a better heat dissipation medium. Due to this miniaturization, heat fluxes increase to values beyond the capabilities of conventional cooling systems (i.e. forced air convection and large metal heat sinks).
