ABSTRACT
This chapter analyzes the performance of practically possible AsF5-intercalated top-contact multilayer graphene nanoribbons (TC-MLGNRs) as a potential candidate to replace copper (Cu) for local, intermediate and global interconnects at deeply scaled technology nodes. It describes the methodology to analyze the various performance parameters for MLGNR interconnect. Further, it can be also be inferred that even with fewer GNR layers, AsF5 intercalation leads to lower resistance as compared to neutral TC-MLGNRs. A minimum-sized driver has been considered for analysis of local interconnects. For the International Technology Roadmap for Semiconductors (ITRS) technology year 2026, the Cu resistivity will reach 16 μΩ.cm under the effect of various width-dependent scattering mechanisms. Cu thickness is taken as 13.2 nm for local interconnects. For ITRS technology year 2026, Cu thickness is taken as 13.2 nm for intermediate interconnects. Typical interconnect length lies between 20 µm and 500 µm.
